| 微电子科学与工程
《集成电路工艺技术课程设计》课程教学大纲
Course Outline
课程基本信息(Course Information) |
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课程代码 (Course Code) |
MR320 |
*学时 (Credit Hours) |
32 |
*学分 (Credits) |
2 |
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(Course Title) |
(中文)集成电路工艺技术课程设计 |
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(英文)IC Fabrication Simulation and Laboratories |
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*课程性质 (Course Type) |
上机 + 实验 |
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授课对象 (Target Audience) |
微电子科学与工程专业(本科生)本科三年级 |
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*授课语言 (Language of Instruction) |
中文 |
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*开课院系 (School) |
学院概况微纳电子学系 |
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先修课程 (Prerequisite) |
半导体器件物理;集成电路工艺制造 |
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授课教师 (Instructor) |
黄其煜 |
课程网址 (Course Webpage) |
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*课程简介(Description) |
该课程为本科三年级学生开设。《集成电路工艺技术课程设计》是半导体器件与制造工艺方向的专业选修课。通过本课程的学习和实验,使学生掌握借助TCAD器件和工艺模拟仿真软件对集成电路工艺制造过程进行模拟以及掌握集成电路制造的基本工艺步骤和工艺操作。本课程为学生深入理解半导体器件以及集成电路制造工艺,实践基础的集成电路制造工艺操作提供了一种生动、直观而且重要的手段,是学习和了解当今集成电路制造和微加工技术的重要基础课程。 本课程主要实践两方面的内容:(1)学习使用Silvaco工艺仿真软件来模拟集成电路制造过程中的各工艺步骤,并通过器件仿真软件对工艺模拟的结果进行验证;(2)学习实践集成电路制造的基本工艺步骤和工艺操作,包括:湿法清洗、氧化、光刻、湿法刻蚀等。并通过后道工艺步骤的演示让学生对于芯片的dicing,bonding,molding以及测试等有直观感性地了解。 |
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*课程简介(Description) |
The course is for the 3rd year undergraduate. It is one of electives of students with specialty in the semiconductor devices and IC fabrication area. The objective of this course is for the students to simulate the device performance and the IC fabrication process by using TCAD software suite and to get hands-on experience on the basic operations and skills to fabricate an IC. This course also provides the students a vivid, intuitive, yet important means to get a better understanding of semiconductor device and IC fabrication and to practice the basic IC fabrication operations and skills. It is an important course to learn and understand the state-of-art IC fabrication and micro/nano-fabrication technologies. This course mainly practices two parts, the first is to learn the use of Silvaco TCAD tool to simulate the manufacturing of devices by individual manufacturing steps and the performance of devices obtained; the second part is to practice basic IC fabrication operations, including wet cleaning, oxidation, photolithography, wet etching, and etc. A video demo is also presented to let the students have an intuitive understanding of the back end operations, including the chip dicing, bonding, molding, and testing. |
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课程教学大纲(course syllabus) |
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*学习目标(Learning Outcomes) |
1.初步掌握Silvaco软件的使用; 2.学习安全使用化学药品; 3.了解并实践集成电路工艺步骤。 |
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*教学内容、进度安排及要求 (Class Schedule &Requirements) |
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*考核方式 (Grading) |
出勤20% + 实验报告 60% + 大作业及讲演 20% |
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*教材或参考资料 (Textbooks & Other Materials) |
自编讲义 |
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其它 (More) |
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备注 (Notes) |
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备注说明:
1.带*内容为必填项。
2.课程简介字数为300-500字;课程大纲以表述清楚教学安排为宜,字数不限。